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about us
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Ceramic PCB

PCB Assembly

SMT Assembly

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PCB Manufacturing
Created with Pixso.

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module

MOQ: 1
Price: Send us Gerber file for free quotation
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Layer:
6 Layer
Material:
Fr4
Thickness:
1.5mm
Min. Line Width/Space:
0.1/0.1mm
Copper Thickness:
1OZ
Surface Treatment:
Immersion Gold
Application:
Power Module
Certificate:
UL & IPC Standard & ISO
Highlight:

Multilayer electronics pcb manufacturing

,

1OZ electronics pcb manufacturing

,

1OZ pcb design manufacturing

Product Description

 

Multilayer PCB Manufacturing for Power Module 

 

♦ What's Multilayer PCB?

 

A ​​Multilayer PCB (Printed Circuit Board)​​ is a type of PCB that consists of three or more conductive copper layers laminated together with insulating material (substrate) to form a compact, high-density circuit board. These layers are interconnected through ​​vias​​ (plated holes) to establish electrical connections between them.

 

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 0 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 1 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 2

 

 

♦ ​​​​Key Features of Multilayer PCBs:​​

 

    1. ​​Multiple Layers:​​ Typically 4, 6, 8, or even up to 50+ layers in advanced applications.
    2. ​​High Density:​​ Allows complex circuitry in a smaller footprint.
    3. ​​Improved Performance:​​ Better signal integrity, reduced EMI (electromagnetic interference), and controlled impedance.
    4. ​​Power & Ground Planes:​​ Dedicated layers for power and ground improve stability and reduce noise.
    5. ​​Complex Applications:​​ Used in high-speed digital, RF, and high-power circuits.

 

 

♦ Technical Parameters

 

Item

Specification

Laers

1~64

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.

 
 
 
♦ One-Stop PCBs Solution

 

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 3 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 4 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 5 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 6
PCB Prototype Felx PCB  Rigid-Flex PCB Aluminium PCB
Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 7 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 8 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 9 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
♦ Advantages of DQS Team
 
  1. On-time Delivery:  
    • Owned PCBA factories 15,000㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

 

 

 

Tags: 

Fr4 pcb board fabrication  

1OZ pcb design manufacturing  

Low Volume circuit board fabrication

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