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PCB Manufacturing
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Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module

MOQ: 1
Price: Send us Gerber file for free quotation
Payment Terms: T/T
Detail Information
Layer:
6 Layer
Material:
Fr4
Thickness:
1.5mm
Min. Line Width/Space:
0.1/0.1mm
Copper Thickness:
1OZ
Surface Treatment:
Immersion Gold
Application:
Power Module
Certificate:
UL & IPC Standard & ISO
Highlight:

Multilayer electronics pcb manufacturing

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1OZ electronics pcb manufacturing

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1OZ pcb design manufacturing

Product Description

 

Multilayer PCB Manufacturing for Power Module 

 

What's Multilayer PCB?

 

A ​​Multilayer PCB (Printed Circuit Board)​​ is a type of PCB that consists of three or more conductive copper layers laminated together with insulating material (substrate) to form a compact, high-density circuit board. These layers are interconnected through ​​vias​​ (plated holes) to establish electrical connections between them.

 

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 0 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 1 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 2

 

 

♦ ​​​​Key Features of Multilayer PCBs:​​

 

    1. ​​Multiple Layers:​​ Typically 4, 6, 8, or even up to 50+ layers in advanced applications.
    2. ​​High Density:​​ Allows complex circuitry in a smaller footprint.
    3. ​​Improved Performance:​​ Better signal integrity, reduced EMI (electromagnetic interference), and controlled impedance.
    4. ​​Power & Ground Planes:​​ Dedicated layers for power and ground improve stability and reduce noise.
    5. ​​Complex Applications:​​ Used in high-speed digital, RF, and high-power circuits.

 

 

Technical Parameters

 

Item

Specification

Laers

1~64

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.

 
 
 
One-Stop PCBs Solution

 

Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 3 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 4 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 5 Multilayer 1OZ Electronics PCB Manufacturing Design For Power Module 6
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Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
 
  1. On-time Delivery:  
    • Owned PCBA factories 15,000㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production