MOQ: | 1 |
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Payment Terms: | T/T |
Supply Ability: | 200,000+ m² PCB per Month |
Micro Blind Buried Via HDI PCB High Speed PCB Medical Imaging Equipment
♦ What is HDI PCB?
HDI PCB uses micro blind/buried vias and build-up technology to create high-density circuits. It forms micron-level interlayer connections via laser drilling and electrochemical plating, eliminating reliance on traditional through-holes. Basic versions have single-layer structures, while advanced variants stack multiple layers with technologies like stacked vias and laser direct imaging to boost density and performance.
♦ Characteristics of HDI PCB
High Circuit Density – Smaller traces and spaces allow more components per unit area.
Microvias (Blind/Buried Vias) – Laser-drilled microvias enable dense interconnections without traditional through-holes.
Fine Pitch Components – Supports tiny packages like BGA, QFN, and 0.4mm pitch ICs.
Multi-Layer Stacking – Advanced builds (4+ layers or more) with stacked vias for higher performance.
♦ Applications of HDI PCB
Medical field: used in pacemakers, CT scanners, medical imaging equipment, etc., to meet the requirements of equipment miniaturization, high performance and high reliability. For example, the utilization rate of HDI PCB in high-end medical equipment exceeds 70%.
Aerospace: used in aircraft avionics systems, satellite communications, navigation systems, etc., to meet the high performance and high reliability requirements of equipment in extreme environments. For example, the aircraft autopilot system uses HDI PCB to ensure flight safety.
Industrial control: used in programmable logic controllers (PLCs), industrial robot control systems, etc., to adapt to complex industrial environments and ensure precise control of industrial production.
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |