Lighting PCB Assembly SMT Welding High Brightness Lamp Beads
♦ What is Lighting PCB Assembly?
Lighting PCB Assembly is a specialized electronic assembly that integrates circuit boards with lighting components (e.g., LEDs, drivers) and control systems. It serves as the core functional unit in diverse lighting applications, combining electrical connectivity, thermal management, and intelligent control to enable efficient, durable, and feature-rich lighting solutions.
♦ Features of Lighting PCBA:
Intelligent Control: Equipped with smart sensing (e.g., auto on/off via human proximity detection) and remote functionality, including dimming, scheduling, and scene presets. Enables full-home smart control via mobile app or voice commands.
Dimming & Speed Regulation: Delivers precise light intensity and device speed adjustment for optimal comfort.
High Sensitivity: Advanced sensor PCBAs ensure rapid and accurate human motion detection.
Elegant Design: Aesthetically optimized to seamlessly integrate with diverse interior environments.
♦ Applications of Lighting PCBA:
Home and commercial lighting: indicator lights, decorative lighting, architectural atmosphere lights, backlights and sign lighting, etc.
Automotive electronics: signal lights, brake lights, dashboard backlights and atmosphere lights to improve safety and performance.
Medical equipment: high-power inspection equipment to ensure heat dissipation and stability.
Computer hardware: power devices, CPU boards and other components with high heat dissipation requirements.
Communication equipment: heat dissipation of LED indicators and display screens to ensure stable operation.
♦ Technical Parameters
PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
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