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12 Layer High Frequency High Speed PCB for Communication Equipment
♦ What's High Speed PCB?
A High-Speed PCB is a printed circuit board designed to handle fast digital signals with minimal distortion, crosstalk, or timing errors. These PCBs are optimized for signal integrity (SI) and power integrity (PI) in applications where signal frequencies exceed 50 MHz–100+ GHz, such as in 5G networks, high-performance computing, and advanced data communication systems.
♦ Key Characteristics of High-Speed PCBs
✅ Controlled Impedance – Ensures signal reflections are minimized (e.g., 50Ω or 100Ω differential pairs).
✅ Low Signal Loss – Uses low-loss dielectric materials (e.g., Rogers, Isola) to reduce attenuation.
✅ Minimal Crosstalk – Careful trace spacing and shielding prevent interference.
✅ Strict Timing Requirements – Matched trace lengths for differential pairs (e.g., PCIe, DDR5).
✅ Optimized Power Delivery – Low-impedance power planes to prevent voltage drops.
♦ Critical Design Considerations
♦ Technical Parameters
Item |
Specification |
Laers |
1~32 |
Board thickness |
0.1mm-7.0mm |
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
Max panel size |
32"×48"(800mm×1200mm) |
Min hole size |
0.075mm |
Min line width |
3mil(0.075mm) |
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
Copper thickness |
0.5-7.0OZ |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Min PAD |
5mil(0.13mm) |
Inter package |
Vacuum |
Outer package |
Carton |
Outline tolerance |
±0.75mm |
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
Special request |
Blind hole+Gold finger + BGA |
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |