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PCB Manufacturing
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Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment

Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment

MOQ: 1
Price: Send us Gerber file for free quotation
Payment Terms: T/T
Detail Information
Layer:
8 Layer
Material:
Rogers
Thickness:
1.5mm
Min. Line Width/Space:
0.1/0.1mm
Copper Thickness:
1.5OZ
Surface Treatment:
Immersion Gold
Application:
Radar
Certificate:
UL & IPC Standard & ISO
Highlight:

Immersion Gold multilayer circuit board

,

sMD multilayer circuit board

,

12 Layer smd circuit board

Product Description

 

12 Layer High Frequency High Speed PCB for Communication Equipment

 

What's High Speed PCB?

 

A ​​High-Speed PCB​​ is a printed circuit board designed to handle ​​fast digital signals with minimal distortion, crosstalk, or timing errors​​. These PCBs are optimized for signal integrity (SI) and power integrity (PI) in applications where signal frequencies exceed ​​50 MHz–100+ GHz​​, such as in ​​5G networks, high-performance computing, and advanced data communication systems​​.

 

Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 0 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 1 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 2

 

♦ ​​​​Key Characteristics of High-Speed PCBs​​​

 

✅ ​​Controlled Impedance​​ – Ensures signal reflections are minimized (e.g., 50Ω or 100Ω differential pairs).
✅ ​​Low Signal Loss​​ – Uses ​​low-loss dielectric materials​​ (e.g., Rogers, Isola) to reduce attenuation.
✅ ​​Minimal Crosstalk​​ – Careful trace spacing and shielding prevent interference.
✅ ​​Strict Timing Requirements​​ – Matched trace lengths for differential pairs (e.g., PCIe, DDR5).
✅ ​​Optimized Power Delivery​​ – Low-impedance power planes to prevent voltage drops.

 

 

♦ ​​Critical Design Considerations​​​​

 

1. Material Selection​​

    • ​​Standard FR-4​​ (for < 1 GHz signals).
    • ​​High-Speed Laminates​​ (e.g., ​​Rogers RO4000, Isola I-Tera, Panasonic Megtron 6​​) for > 5 Gbps signals.

​​2. Layer Stackup​​

    • ​​Signal Layers​​ – Adjacent to ground planes for impedance control.
    • ​​Power Planes​​ – Low-inductance design with decoupling capacitors.
    • ​​Symmetrical Stackup​​ – Prevents warping and ensures consistent performance.

​​3. Trace Routing​​

    • ​​Differential Pairs​​ – Tightly coupled with matched lengths (e.g., USB 3.2, HDMI).
    • ​​Avoid 90° Bends​​ – Use ​​45° or curved traces​​ to reduce reflections.
    • ​​Via Optimization​​ – Minimize stubs (use ​​blind/buried vias​​ for HDI designs).

​​4. Power Integrity (PI)​​

    • ​​Low-ESR Decoupling Caps​​ – Placed near ICs to suppress noise.
    • ​​Power Plane Splitting​​ – Avoids interference between analog/digital sections.

​​5. EMI/EMC Mitigation​​

    • ​​Ground Shielding​​ – Via stitching around high-speed traces.
    • ​​EMI Filters​​ – For RF-sensitive circuits

 

 

Technical Parameters

 

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.

 
 
 
One-Stop PCBs Solution

 

Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 3 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 4 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 5 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 6
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Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 7 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 8 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 9 Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
 
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production