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Lighting PCB Assembly High Sensitivity Sensor Light
♦ What is Lighting PCB Assembly?
Lighting PCB Assembly is a specialized electronic assembly that integrates circuit boards with lighting components (e.g., LEDs, drivers) and control systems. It serves as the core functional unit in diverse lighting applications, combining electrical connectivity, thermal management, and intelligent control to enable efficient, durable, and feature-rich lighting solutions.
♦ Features of Lighting PCBA:
Intelligent Control: Equipped with smart sensing (e.g., auto on/off via human proximity detection) and remote functionality, including dimming, scheduling, and scene presets. Enables full-home smart control via mobile app or voice commands.
Dimming & Speed Regulation: Delivers precise light intensity and device speed adjustment for optimal comfort.
High Sensitivity: Advanced sensor PCBAs ensure rapid and accurate human motion detection.
Elegant Design: Aesthetically optimized to seamlessly integrate with diverse interior environments.
♦ Applications of Lighting PCBA:
Home Lighting: Like all kinds of lamps and lanterns in the family, such as chandeliers, wall lamps, table lamps, etc. can be equipped with corresponding Lighting PCBA to achieve intelligent control.
Commercial Lighting: Widely used in the lighting system of commercial places such as shopping malls, hotels, office buildings, etc. Lighting can be controlled according to different scenes and time to create the right atmosphere.
Public Lighting: Used in lighting facilities in streets, parks, squares and other public places to achieve centralised control and intelligent management through Lighting PCBA, improving lighting efficiency and energy saving.
♦ Technical Parameters
PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
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