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PCB Manufacturing
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High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger

High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger

MOQ: 1
Price: Send us Gerber file for free quotation
Payment Terms: T/T
Detail Information
Layer:
1-108 Layer
Base Material:
Fr4
Thickness:
0.5-10mm
Copper Thickness:
0.5-15OZ
Board Size:
Customized
Min. Line Width/Space:
0.10/0.10mm
Surface Treatment:
ENIG/Immersion Gold
Certificate:
UL,IATF16949,ISO&Reach
Highlight:

Fr4 pcb board fabrication

,

Charger pcb board fabrication

,

Fr4 pcb fabrication assembly

Product Description

High Precision PCB Fabrication Assembly for Wireless Charger

 

 

What's PCB Fabrication?

 

​​PCB Fabrication​​ (or ​​PCB Manufacturing​​) is the process of transforming a circuit board design (typically provided as ​​Gerber files​​) into a physical printed circuit board (PCB). It involves multiple steps, from etching copper layers to drilling holes and applying protective coatings, resulting in a bare PCB ready for component assembly.

 

High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 0 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 1 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 2

 

 

♦ Key Steps in PCB Fabrication​:​

 

1. Design & File Preparation​​

    • The process starts with ​​PCB design files​​ (Gerber, drill files, BOM).
    • Engineers verify the design for manufacturability (​​DFM check​​).

​​2. Printing the Design on Copper Clad Laminate​​

    • A ​​photosensitive film​​ is applied to a copper-clad board (usually ​​FR4​​).
    • The PCB layout is printed using UV light, transferring the circuit pattern.

​​3. Etching the Copper​​

    • The board is chemically etched (​​acid bath​​) to remove unwanted copper, leaving only the desired traces.

​​4. Drilling Holes​​

    • Precision ​​CNC machines​​ drill holes for ​​vias​​ (plated holes) and component leads.
    • ​​Laser drilling​​ is used for ​​microvias​​ in HDI (High-Density Interconnect) PCBs.

​​5. Plating & Copper Deposition​​

    • ​​Electroplating​​ adds a thin copper layer to the drilled holes, creating electrical connections between layers.
    • Additional coatings (e.g., ​​ENIG, HASL, OSP​​) may be applied for solderability.

​​6. Applying Solder Mask & Silkscreen​​

    • ​​Solder mask​​ (usually green) is added to prevent short circuits.
    • ​​Silkscreen​​ prints component labels (text, logos).

​​7. Surface Finish Application​​

    • Common finishes:
      • ​​HASL (Hot Air Solder Leveling)​​ – Traditional, cost-effective.
      • ​​ENIG (Electroless Nickel Immersion Gold)​​ – Flat surface, good for fine-pitch components.
      • ​​OSP (Organic Solderability Preservative)​​ – Simple, but less durable.

​​8. Electrical Testing & Quality Control​​

    • ​​Automated Optical Inspection (AOI)​​ checks for defects.
    • ​​Flying Probe Test​​ or ​​Bed-of-Nails Test​​ verifies electrical connectivity.

​​9. Final Cutting & Packaging​​

    • The PCB panel is ​​routed​​ into individual boards.
    • Boards are inspected and shipped for ​​PCB Assembly (PCBA)​​.

 

 

♦ ​​Types of PCB Fabrication​​:​

 

Type Description Common Uses
​Single-Layer PCB​ Only one conductive layer. Simple electronics (LEDs, calculators).
​Double-Layer PCB​ Copper on both sides. Consumer electronics, power supplies.
​Multi-Layer PCB​​ (4+ layers) Multiple conductive layers. Smartphones, servers, medical devices.
​Flexible PCB​ Made of bendable materials (polyimide). Wearables, aerospace, foldable devices.
​Rigid-Flex PCB​ Combines rigid and flexible sections. Military, medical implants.
​HDI PCB​ High-density interconnects (microvias). 5G, IoT, compact electronics.

 

 

Technical Parameters

 

Item

Specification

Laers

1~64

Board thickness

0.1mm-10.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.

 
 
 
One-Stop PCBs Solution

 

High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 3 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 4 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 5 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 6
PCB Prototype Felx PCB  Rigid-Flex PCB Aluminium PCB
High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 7 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 8 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 9 High Precision Fr4 PCB Board Fabrication Assembly For Wireless Charger 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production