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12 Layers HDI High Frequency Rigid PCB
♦ What is HDI (High-Density Interconnect)?
HDI (High-Density Interconnect) refers to a PCB (Printed Circuit Board) technology that enables higher wiring density per unit area compared to traditional PCBs. HDI boards use finer traces, smaller vias, and tighter spacing to accommodate complex, compact electronic devices like smartphones, wearables, and advanced medical equipment.
♦ HDI vs. Standard PCB: Key Differences?
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |