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High Frequency HDI Rigid Flexible PCB Fast Turnaround Board 12 Layers

MOQ:	1
Price:	Contact Us
Payment Terms:	T/T
Supply Ability:	200,000+ m² PCB per Month

Detail Information

Product Description

Detail Information

Layer:

10 Layers

Material:

Fr4

Thickness:

2.0 Mm

Construction:

2+N+2

Min. Line Width/Space:

0.1/0.1mm

Surface Treatment:

Immersion Gold

Type:

Customizable

Application:

Medical Device

Standard:

UL&IPC Standard &ISO

Supply Ability:

200,000+ m² PCB per Month

Highlight:

Rigid pcb fast turnaround

12 Layers pcb fast turnaround

HDI flexible pcb board

Product Description

12 Layers HDI High Frequency Rigid PCB

♦ What is HDI (High-Density Interconnect)?

HDI (High-Density Interconnect) refers to a PCB (Printed Circuit Board) technology that enables higher wiring density per unit area compared to traditional PCBs. HDI boards use finer traces, smaller vias, and tighter spacing to accommodate complex, compact electronic devices like smartphones, wearables, and advanced medical equipment.

Key Characteristics:

1. Microvias (laser-drilled, smaller than mechanical drills)
  - Blind vias (connect outer to inner layers)
  - Buried vias (connect inner layers only)
  - Stacked or staggered microvias (for ultra-high density)
2. Finer Trace Width/Spacing (as low as 2/2 mil or less)
3. Thinner Materials (for lightweight, flexible designs)
4. Sequential Lamination (multiple lamination cycles for complex layer transitions)
5. Via-in-Pad & Filled Vias (for better component mounting)

♦ HDI vs. Standard PCB: Key Differences?

Feature	Standard PCB	HDI PCB
Via Types	Through-hole vias only	Microvias (blind/buried)
Trace Width	≥ 5 mil (0.127 mm)	≤ 3 mil (0.076 mm)
Layer Count	2-16 layers (typical)	8-20+ layers (complex)
Via Size	≥ 8 mil (0.2 mm) drilled	≤ 4 mil (0.1 mm) laser
Applications	Consumer electronics, power systems	Smartphones, 5G, IoT, military/aerospace

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

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