High Density PCB Micro BGA Package Assembly Service Integrated Solution

High-Density BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection

♦ What is BGA Assembly? 

BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA Assembly is a high-density packaging technology in which the chip is soldered directly to the PCB through an array of "micro solder balls," which is like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.

♦ Features of BGA Assembly? 

1. High-Density Interconnections​​

• • • Solder balls are arranged in a grid pattern under the package, allowing for ​​more I/O connections​​ in a smaller area compared to QFP or DIP packages.
    • Ideal for ​​complex ICs​​ like CPUs, GPUs, FPGAs, and memory chips.

​​2. Improved Electrical & Thermal Performance​​

• • • ​​Shorter electrical paths​​ reduce inductance and improve signal integrity (better for high-speed circuits).
    • ​​Efficient heat dissipation​​ due to direct thermal contact with the PCB (often paired with heatsinks).

​​3. Space-Efficient & Lightweight​​

• • • Eliminates bulky leads, enabling ​​compact PCB designs​​ (common in smartphones, laptops, and IoT devices).

​​4. Strong Mechanical Bonding​​

• • • Solder balls provide ​​better shock/vibration resistance​​ than fine-pitch leaded packages (e.g., QFP).

​​5. Challenges in Assembly & Rework​​

• • • ​​X-ray or AOI (Automated Optical Inspection) required​​ since solder joints are hidden under the chip.
    • ​​Precise reflow soldering needed​​ (temperature control is critical to prevent voids or bridging).

♦ Technical Parameters

 

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Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA