DQS Electronic Co., Limited
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
PCB Assembly
Created with Pixso.

High Density PCB Micro BGA Package Assembly Service Integrated Solution

High Density PCB Micro BGA Package Assembly Service Integrated Solution

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Certification:
ISO,UL,IATF16949,RoHs
Base Material:
FR-4
Copper Thickness:
2OZ
Min. Line Spacing:
3mil
Board Thickness:
2.0mm
Min. Line Width:
0.2mm
Min. Hole Size:
0.1mm
Surface Finishing:
Immersion Gold
Application:
Consumer Electronics,Industry/Medical/Consumer Electronic
Solder Mask Color:
Green Black Red,Blue.green.red.black.white.etc
Pcb Test:
Flying Probe And AOI Test,Flying-Probe PCB Test
Pcb Assembly Method:
Mixed,BGA,SMT,Through-hole
Highlight:

PCB micro bga package

,

Integrated micro bga package

,

Integrated pcb assembly bga

Product Description

 

High-Density BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection

 

♦ What is BGA Assembly? 

 

BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA Assembly is a high-density packaging technology in which the chip is soldered directly to the PCB through an array of "micro solder balls," which is like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.

 

 

♦ Features of BGA Assembly? 

1. High-Density Interconnections​​

      • Solder balls are arranged in a grid pattern under the package, allowing for ​​more I/O connections​​ in a smaller area compared to QFP or DIP packages.
      • Ideal for ​​complex ICs​​ like CPUs, GPUs, FPGAs, and memory chips.

​​2. Improved Electrical & Thermal Performance​​

      • ​​Shorter electrical paths​​ reduce inductance and improve signal integrity (better for high-speed circuits).
      • ​​Efficient heat dissipation​​ due to direct thermal contact with the PCB (often paired with heatsinks).

​​3. Space-Efficient & Lightweight​​

      • Eliminates bulky leads, enabling ​​compact PCB designs​​ (common in smartphones, laptops, and IoT devices).

​​4. Strong Mechanical Bonding​​

      • Solder balls provide ​​better shock/vibration resistance​​ than fine-pitch leaded packages (e.g., QFP).

​​5. Challenges in Assembly & Rework​​

      • ​​X-ray or AOI (Automated Optical Inspection) required​​ since solder joints are hidden under the chip.
      • ​​Precise reflow soldering needed​​ (temperature control is critical to prevent voids or bridging).

 

 

♦ Technical Parameters

 

 PCB Assembly Capability

 

Item

 

                  Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

                      T>2mm

 

 

 

 

♦ One-Stop PCBA Solution

 

High Density PCB Micro BGA Package Assembly Service Integrated Solution 0 High Density PCB Micro BGA Package Assembly Service Integrated Solution 1 High Density PCB Micro BGA Package Assembly Service Integrated Solution 2 High Density PCB Micro BGA Package Assembly Service Integrated Solution 3
PCBA Prototype Industrial Control PCBA Telecom PCBA Medical PCBA
High Density PCB Micro BGA Package Assembly Service Integrated Solution 4 High Density PCB Micro BGA Package Assembly Service Integrated Solution 5 High Density PCB Micro BGA Package Assembly Service Integrated Solution 6 High Density PCB Micro BGA Package Assembly Service Integrated Solution 7
Automotive PCBA Consumer Electronic PCBA LED PCBA  Security PCBA

 

 
 
 
♦ Advantages of DQS Team
 
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production