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PCB Manufacturing
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High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

MOQ: 1
Price: Contact Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Detail Information
Layer:
10 Layers
Material:
Fr4
Thickness:
2.0 Mm
Construction:
2+N+2
Min. Line Width/Space:
0.1/0.1mm
Surface Treatment:
Immersion Gold
Type:
Customizable
Application:
Electronic Product
Standard:
UL&IPC Standard &ISO
Supply Ability:
200,000+ m² PCB per Month
Highlight:

3OZ hdi pcb fabrication

,

Smartphones hdi pcb fabrication

,

3OZ smartphone pcb

Product Description

 

12 Layer 3OZ High Density Interconnect HDI PCB

 

 

♦ What is High Density PCB (HDI PCB)?

 

A ​​High Density Interconnect (HDI) PCB​​ is an advanced printed circuit board designed to accommodate ​​more components in a smaller space​​ by using ​​finer traces, smaller vias, and higher connection density​​ than traditional PCBs. HDI technology enables ​​miniaturization, improved signal integrity, and enhanced performance​​ in modern electronics.

 

 

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 0 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 1 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 2

 

 

 

♦ ​​​​Key Features of HDI PCBs​​​:

 

✅ ​​Finer Trace Width/Spacing​​ (≤ 100µm, vs. standard 150µm+).

✅ ​​​Microvias​​ (laser-drilled, < 150µm diameter) for high-density interconnects. 

✅ ​​​​Blind & Buried Vias​​ (instead of through-hole vias) to save space.

✅ ​​Thinner Dielectric Materials​​ (for compact layer stacking).

✅ ​​Higher Layer Count​​ (often 8+ layers in a slim profile).

✅ ​​​Advanced Materials​​ (low-loss dielectrics for high-speed signals).

 

 

♦ ​​HDI PCB vs. Standard PCB: Key Differences​​?​

 

Feature ​HDI PCB​ ​Standard PCB​
​Trace Width​ ≤ 100µm (can go down to 40µm) ≥ 150µm
​Via Size​ Microvias (50–150µm) Through-hole vias (≥ 300µm)
​Via Types​ Blind, buried, stacked Mostly through-hole
​Layer Count​ 8+ (with thin dielectrics) Typically 2–12 layers
​Signal Speed​ Optimized for high-speed signals Limited high-speed performance
​Applications​ Smartphones, wearables, aerospace Consumer electronics, power circuits

 

 

♦ ​​​​Types of HDI PCBs​​​​:

    1. ​​1+N+1​​ – Single HDI layer (microvias on outer layers).
    2. ​​2+N+2​​ – Two HDI layers (stacked microvias).
    3. ​​3+N+3​​ – Three or more HDI layers (ultra-high density, used in advanced chips).
    4. ​​Any-Layer HDI​​ – Microvias can be placed anywhere (used in smartphones like iPhones).

 

 

Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

One-Stop PCBs Solution

 

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 3 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 4 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 5 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 6
PCB Prototype Felx PCB  Rigid-Flex PCB Ceramic PCB
High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 7 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 8 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 9 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production