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Created with Pixso. Home Created with Pixso. Products Created with Pixso.
PCB Manufacturing
Created with Pixso.

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

MOQ: 1
Price: Contact Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Detail Information
Product Description
Detail Information
Layer:
10 Layers
Material:
Fr4
Thickness:
2.0 Mm
Construction:
2+N+2
Min. Line Width/Space:
0.1/0.1mm
Surface Treatment:
Immersion Gold
Type:
Customizable
Application:
Electronic Product
Standard:
UL&IPC Standard &ISO
Supply Ability:
200,000+ m² PCB per Month
Highlight:

3OZ hdi pcb fabrication

,

Smartphones hdi pcb fabrication

,

3OZ smartphone pcb

Product Description

 

12 Layer 3OZ High Density Interconnect HDI PCB

 

 

♦ What is High Density PCB (HDI PCB)?

 

A ​​High Density Interconnect (HDI) PCB​​ is an advanced printed circuit board designed to accommodate ​​more components in a smaller space​​ by using ​​finer traces, smaller vias, and higher connection density​​ than traditional PCBs. HDI technology enables ​​miniaturization, improved signal integrity, and enhanced performance​​ in modern electronics.

 

 

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 0 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 1 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 2

 

 

 

♦ ​​​​Key Features of HDI PCBs​​​:

 

✅ ​​Finer Trace Width/Spacing​​ (≤ 100µm, vs. standard 150µm+).

✅ ​​​Microvias​​ (laser-drilled, < 150µm diameter) for high-density interconnects. 

✅ ​​​​Blind & Buried Vias​​ (instead of through-hole vias) to save space.

✅ ​​Thinner Dielectric Materials​​ (for compact layer stacking).

✅ ​​Higher Layer Count​​ (often 8+ layers in a slim profile).

✅ ​​​Advanced Materials​​ (low-loss dielectrics for high-speed signals).

 

 

♦ ​​HDI PCB vs. Standard PCB: Key Differences​​?​

 

Feature ​​HDI PCB​​ ​​Standard PCB​​
​​Trace Width​​ ≤ 100µm (can go down to 40µm) ≥ 150µm
​​Via Size​​ Microvias (50–150µm) Through-hole vias (≥ 300µm)
​​Via Types​​ Blind, buried, stacked Mostly through-hole
​​Layer Count​​ 8+ (with thin dielectrics) Typically 2–12 layers
​​Signal Speed​​ Optimized for high-speed signals Limited high-speed performance
​​Applications​​ Smartphones, wearables, aerospace Consumer electronics, power circuits

 

 

♦ ​​​​Types of HDI PCBs​​​​:

    1. ​​1+N+1​​ – Single HDI layer (microvias on outer layers).
    2. ​​2+N+2​​ – Two HDI layers (stacked microvias).
    3. ​​3+N+3​​ – Three or more HDI layers (ultra-high density, used in advanced chips).
    4. ​​Any-Layer HDI​​ – Microvias can be placed anywhere (used in smartphones like iPhones).

 

 

♦ Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

♦ One-Stop PCBs Solution

 

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 3 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 4 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 5 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 6
PCB Prototype Felx PCB  Rigid-Flex PCB Ceramic PCB
High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 7 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 8 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 9 High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
♦ Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

 

 

 

Tags: 

Fr4 pcb board fabrication  

1OZ pcb design manufacturing  

Low Volume circuit board fabrication

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