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Electronic PCBA
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Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente

Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente

MOQ: 1
Price: Inquiry Us
Payment Terms: T/T
Detail Information
Layer:
6L
Min. Component Size:
01005
Board Thickness:
1.0mm
Pin Space:
0.1mm
Testing Method:
Flying Probe, ICT, Functional Test
Application:
Laptop Motherboard
Highlight:

BGA Electronic PCBA

,

Electronic PCBA Motherboard

,

BGA componente pcb

Product Description

Efficient Heat Dissipation Electronic PCBA as Laptop Motherboard

 

What is Consumer Electronics PCBA?

 

Consumer Electronics PCBA (Consumer Electronics Printed Circuit Board Assembly) is the core circuit board of consumer electronic products (such as mobile phones, TVs, headphones, etc.). Components are integrated on the PCB through SMT patch and DIP plug-in processes to achieve device function control and data processing.

 

Features of Laptop Motherboard PCBA

    • ​​High integration​​: Using surface mount technology, etc., a large number of electronic components are integrated in a limited space to achieve complex functions.
    • ​​Lightweight and portable​​: Using light and thin PCB materials, combined with compact design, to meet the portability requirements of notebooks.
    • ​​Efficient heat dissipation​​: Through reasonable layout and heat dissipation design, such as large-area heat sinks, heat pipes, etc., the heat generated by CPU, GPU, etc. can be effectively dissipated.
    • ​​Stable and reliable​​: After rigorous testing and inspection, it has good electrical performance and mechanical stability, and can adapt to different usage environments

 

Applications of Consumer Electronics PCBA

    • Mobile phones/tablets: integrated chips, communication modules, support high-performance computing and portable design.
    • Computers/laptops: motherboard core, carrying processors, memory and multi-interface functions.
    • Audio-visual equipment: signal processing and interactive control of TVs, game consoles, and speakers.
    • Smart home: communication and logic control of smart speakers, thermostats and other devices.
    • Wearable devices: miniaturized and highly integrated solutions for smart watches and health monitoring equipment.
    • Photographic imaging: image processing and storage control of cameras and camcorders.
    • Home appliances: functional realization of smart home appliances such as microwave ovens and washing machines.

 

♦ DQS's PCB Assembly Capability

 

 

Item

 

Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

     T>2mm

 

 

 

♦ One-Stop Electronic Manufacturing Including

 

 PCB Prototype

Quick Turn PCB

Single-Sided PCB

Double-Sided PCB

 Multilayer PCB

Rigid PCB

Flexible PCB

Rigid-Flex PCB Rigid-Flex PCB Aluminum PCB Metal Core PCB

Thick Copper PCB

HDI PCB

BGA PCB High TG PCB PCB Stencil Impedance Control PCB

PCB Assembly

High-Frequency PCB Bluetooth Circuit Board Automotive PCB USB Circuit Board Halogen-Free PCB

Antenna PCB

 

 

Core Competencies of DQS PCB Assembly

 

SMT

Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente 0

DIP

Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente 1

  • 13 automatic high-speed SMT line
  • 5 million points / day
  • FPC/Double sided mounted
  • Automatic conformal coating
  • 4 DIP line
  • Post-soldering700,000 points/day
  • Professional DIP plug-in team
Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente 2 SMT Technology Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente 3 PCBA OEM
  • Min package: 01005  
  • Min pin: 0.3mm
  • Min BGA pitch: 0.3 mm 

 

  •  Full turnkey PCB assembly
  • Partial turnkey PCB assembly