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PCB Manufacturing
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HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM

HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM

MOQ: 1
Price: Inquiry Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Detail Information
Features:
Blind Via,Buried Via
Layer:
6 Layers
Material:
FR4
Copper:
1OZ
Thickness:
0.8 Mm
Min. Line Width/Space:
0.1/0.1mm
Surface Treatment:
ENIG/OSP/HASL
Type:
Customizable
Standard:
UL&IPC Standard &ISO
Supply Ability:
200,000+ m² PCB per Month
Highlight:

HASL hdi pcb board

,

1oz hdi pcb board

,

OEM pcb 1oz

Product Description

Low Loss HDI PCB Board ensures signal integrity

 

 

♦ What is HDI PCB?

 

HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.

 

 

HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 0 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 1 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 2

 

 

 

Characteristics of HDI PCB

    • Good electrical performance: Reduce signal distortion, excellent impedance control, stable electrical performance.

    • Good heat dissipation performance: Unique structure is conducive to heat dissipation and adapts to high-load work.

    • High reliability: Advanced process technology, meet industrial standards, long service life.

 

♦ Difficulties in HDI PCB Processing

    • Difficulty in micro-hole processing: laser drilling requires high precision, and it is easy to have rough hole walls and hole position offset problems.
    • Difficulty in fine lines: line width/line spacing is at the micron level, and it is difficult to control the uniformity of electroplating hole filling.
    • Difficulty in inter-layer alignment: multi-layer board stacking is prone to offset, affecting electrical connection.

 

Applications of HDI PCB

    • Medical field: used in pacemakers, CT scanners, medical imaging equipment, etc., to meet the requirements of equipment miniaturization, high performance and high reliability. For example, the utilization rate of HDI PCB in high-end medical equipment exceeds 70%.

    • Aerospace: used in aircraft avionics systems, satellite communications, navigation systems, etc., to meet the high performance and high reliability requirements of equipment in extreme environments. For example, the aircraft autopilot system uses HDI PCB to ensure flight safety.

    • Industrial control: used in programmable logic controllers (PLCs), industrial robot control systems, etc., to adapt to complex industrial environments and ensure precise control of industrial production.

 

 

Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

One-Stop PCBs Solution

 

HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 3 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 4 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 5 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 6
PCB Prototype Felx PCB  Rigid-Flex PCB Ceramic PCB
HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 7 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 8 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 9 HASL High Density Interconnect HDI PCB Board Single Layer 1oz OEM 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production