MOQ: | 1 |
Price: | Inquiry Us |
Payment Terms: | T/T |
Supply Ability: | 200,000+ m² PCB per Month |
Low Loss HDI PCB Board ensures signal integrity
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.
♦ Characteristics of HDI PCB
Good electrical performance: Reduce signal distortion, excellent impedance control, stable electrical performance.
Good heat dissipation performance: Unique structure is conducive to heat dissipation and adapts to high-load work.
High reliability: Advanced process technology, meet industrial standards, long service life.
♦ Difficulties in HDI PCB Processing
♦ Applications of HDI PCB
Medical field: used in pacemakers, CT scanners, medical imaging equipment, etc., to meet the requirements of equipment miniaturization, high performance and high reliability. For example, the utilization rate of HDI PCB in high-end medical equipment exceeds 70%.
Aerospace: used in aircraft avionics systems, satellite communications, navigation systems, etc., to meet the high performance and high reliability requirements of equipment in extreme environments. For example, the aircraft autopilot system uses HDI PCB to ensure flight safety.
Industrial control: used in programmable logic controllers (PLCs), industrial robot control systems, etc., to adapt to complex industrial environments and ensure precise control of industrial production.
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |