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Medical Mother Board and SMT SMD PCB Assembly
♦ What Is SMT Assembly?
SMT Assembly (Surface Mount Technology Assembly) is a modern method of mounting electronic components directly onto the surface of a printed circuit board (PCB). It is the most widely used PCB assembly technique today, replacing traditional through-hole technology (THT) in most applications due to its efficiency, precision, and ability to support miniaturized and high-density designs.
♦ What Is SMD?
An SMD is an electronic component designed specifically for surface mounting (SMT). These components have small metal pads or terminations instead of long leads.
♦ Common Challenges in SMT/SMD Assembly:
Solutions:
✔ Proper stencil design (for accurate solder paste application)
✔ Reflow profile optimization (temperature control)
✔ AOI & X-ray inspection (for defect detection)
DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com
♦ Technical Parameters
PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
|
Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
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