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PCB Manufacturing
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ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment

ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment

MOQ: 1
Price: Inquiry Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Detail Information
Layer:
8 Layers
Base Material:
FR4 Tg170
Board Thickness:
1.5mm
Construction:
1+6+1
Min. Line Width/Space:
0.1/0.1mm
Surface Treatment:
ENIG
Type:
Customizable
Application:
5G Communication Equipment
Standard:
UL&IPC Standard &ISO
Supply Ability:
200,000+ m² PCB per Month
Highlight:

ENIG HDI 10 layer pcb

,

High Frequency 10 layer pcb

,

ENIG high frequency pcb design

Product Description

8-layer ENIG HDI PCB High Component Density For 5G Communication Equipment

 

 

♦ What is HDI PCB?

 

HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.

 

 

ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 0 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 1 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 2

 

 

 

Characteristics of HDI PCB

    • High circuit density
    • Miniaturization and thinness
    • Excellent signal integrity
    • Good heat dissipation performance
    • High reliability
    • A variety of laminate structures are available

 

 

Applications of HDI PCB

 

    • Consumer electronics: used in smartphones, tablets, smart watches, etc. to achieve thinness and high performance of devices. For example, a mobile phone motherboard adopts HDI design to reduce size, improve performance and stability.
    • Communication field: It is a key component of 5G base stations, satellite communications, optical fiber communications and other equipment to ensure high-speed and stable signal transmission. For example, NVIDIA's GB200NVL72 system achieves a transmission rate of 1800Gbps.
    • Automotive field: used for autonomous driving, in-car entertainment, body control, power systems, etc., to meet the complex environment requirements of automotive electronics and improve automotive intelligence and safety. For example, automotive electronic modules need to be resistant to high temperatures and shockproof, which can be met by HDI PCB.

 

 

Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

One-Stop PCBs Solution

 

ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 3 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 4 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 5 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 6
PCB Prototype Felx PCB  Rigid-Flex PCB Ceramic PCB
ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 7 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 8 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 9 ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry;
    • Perfect after-sales service system;
    • From prototype to mass production