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PCB Assembly

SMT Assembly

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Created with Pixso. Home Created with Pixso. Products Created with Pixso.
PCB Assembly
Created with Pixso.

ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics

ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics

ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
China
Certification:
ISO, UL, IPC, Reach
Layer:
18 Layer
Material:
FR4
Board Thickness:
0.2-10mm
Surface Finish:
ENIG
Pin Space:
0.25mm
Application:
Consumer Electronics
Highlight:

ENIG BGA Assembly

,

FR4 BGA Assembly

,

ENIG pcba bga assembly smt pcb

Product Description

 

Consumer Electronics BGA Assembly

 

 

♦ What Is BGA Assembly?

 

BGA (Ball Grid Array) assembly​​ is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:

    • ​​Higher density connections​​ (more I/O in a smaller space)
    • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
    • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

 

♦ Key Features of Contract Manufacturing:

    1. ​​Solder Paste Application​​ – A stencil deposits solder paste onto PCB pads.
    2. ​​BGA Placement​​ – A pick-and-place machine positions the BGA component accurately.
    3. ​​Reflow Soldering​​ – The PCB is heated in a reflow oven, melting the solder balls to form connections.
    4. ​​Inspection & Testing​​ – X-ray inspection (AXI) checks for alignment and solder joint quality.

 

​​♦ Common Challenges in BGA Assembly:

  1.  
    • ​​Solder joint defects​​ (voids, bridging, cold joints)
    • ​​Difficulty in rework/repair​​ (due to hidden solder joints)
    • ​​Thermal management​​ (BGAs can generate heat, requiring proper PCB design)

 

♦ Technical Parameters

 

 PCB Assembly Capability

 

Item

 

                  Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L＜2mm

Maximum

L≤800mm, W≤460mm

L ＞ 1200mm, W＞500mm

Thickness( T)

Thinnest

0.2mm

T＜0.1mm

Thickest

4 mm

T＞4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm＜T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch＜0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch＜0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L＜50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T＜0.8mm

Thickest

3.5mm

                      T＞2mm

 

 
 
 
♦ Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

 

Would you like details on ​​BGA rework​​ or ​​inspection techniques​​?

 Contact us via email : sales@dqspcba.com

 

 

 

 

 

 

Tags: 

SMT quick turnaround pcb assembly  

Flexible digital pcb assembly  

Electronic small batch pcb assembly

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