Custom Printed SMD Circuit Board PCB Assembly Low Latency For 5G Infrastructure

Low Latency Communications Telecom PCB Assembly for 5G Infrastructure

♦ What's Telecom PCB Assembly?

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

• ​​5G/4G base stations​​
• ​​Fiber-optic networking devices​​
• ​​Satellite communication systems​​
• ​​Routers, switches, and modems​​
• ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

♦ Features of Telecom PCBs:

1. High-Frequency Materials​​

• • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
  • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

• • ​​8+ layers​​ for complex routing.
  • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

• • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
  • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

• • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

• • • ​​IPC-A-600, IPC-6012​​ (for reliability).
    • ​​RoHS, REACH​​ (for environmental safety).
    • ​​FCC, CE, ITU-T​​ (for telecom regulations).

♦ Process characteristics of Telecom PCB Assembly

​​1. Strict component selection

• • Prioritize the use of high-frequency low-loss materials (such as PTFE substrate PCB) and high-temperature resistant chips (working temperature -40℃~125℃);
  • RF components must support high-precision impedance control (such as 50Ω matching).

2. High-precision manufacturing requirements:

• • SMT patch accuracy must reach ±0.025mm (±0.05mm for ordinary PCBA) to ensure precise placement of tiny components (such as 01005 package resistors);
  • Laser drilling and micro-hole electroplating technology to achieve high-density interconnect (HDI) circuit boards.

♦ Technical Parameters

 

♦ One-Stop PCBA Solution

 

PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA
Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA