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PCB Assembly
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5G Communication Module Oem Circuit Boards PCB Assembly Processing

5G Communication Module Oem Circuit Boards PCB Assembly Processing

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
ISO, UL, IPC, Reach
Layer:
12 Layer
Material:
FR4
Board Thickness:
2.5mm
Surface Finish:
Immersion Gold
Pin Space:
0.25mm
Application:
Communication
Highlight:

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oem circuit boards 5G

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Product Description

 

5G Communication Module PCB Assembly Processing

 

 

♦ ​​What is PCB Assembly Processing?

 

PCB Assembly Processing (PCBA)​​ refers to the step-by-step manufacturing workflow where electronic components are mounted onto a bare ​​Printed Circuit Board (PCB)​​ to create a functional electronic device. It involves soldering components, testing, and quality control to ensure the final product meets design specifications.

 

 

 

Key Stages of PCB Assembly Processing​:​

1. PCB Fabrication (Before Assembly)​​

    • The bare PCB is manufactured with copper traces, solder mask, and silkscreen.
    • Includes drilling holes (for through-hole components) and plating vias.

​​2. Solder Paste Application (SMT Process)​​

    • A ​​stencil​​ aligns with the PCB, and solder paste (a mix of tiny solder particles and flux) is applied to pads where components will sit.
    • Ensures precise deposition for strong solder joints.

​​3. Pick-and-Place Machine (SMT Component Mounting)​​

    • ​​Surface-Mount Devices (SMDs)​​ like resistors, capacitors, and ICs are placed automatically by a high-speed robotic machine.
    • Modern machines achieve ​​50,000+ placements per hour​​ with micron-level accuracy.

​​4. Reflow Soldering (SMT Bonding)​​

    • The PCB passes through a ​​reflow oven​​, heating the solder paste to melt and form solid electrical connections.
    • ​​Temperature profile​​ is critical to prevent defects like cold joints or tombstoning.

​​5. Through-Hole Component Insertion (THT Process, if needed)​​

    • Components with leads (e.g., connectors, large capacitors) are inserted into drilled holes.
    • Can be done manually or with automated insertion machines.

​​6. Wave Soldering (For THT Components)​​

    • The PCB moves over a molten solder wave, bonding the through-hole component leads to the board.
    • Less common today due to the dominance of SMT but still used for mixed-technology boards.

​​7. Inspection & Quality Control​​

    • ​​Automated Optical Inspection (AOI)​​ – Checks for missing/misaligned components, solder defects.
    • ​​X-ray Inspection (AXI)​​ – Examines hidden solder joints (e.g., under ​​BGA chips​​).
    • ​​Functional Testing (FCT)​​ – Powers up the PCB to verify performance.

​​8. Conformal Coating & Final Assembly (Optional)​​

    • A protective coating (e.g., silicone, acrylic) may be applied to prevent moisture, dust, and corrosion.
    • Final enclosure assembly (if part of the product).

 

Types of PCB Assembly Processing​:​

 

​Type​ ​Description​ ​Best For​
​Full Turnkey PCBA​ Manufacturer handles everything (PCB fab + component sourcing + assembly). Startups, companies wanting hassle-free production.
​Partial Turnkey​ Customer provides some parts (e.g., specialty ICs), manufacturer does the rest. Custom or high-value projects.
​Prototype Assembly​ Low-volume, quick-turn assembly for testing. R&D, product validation.
​Mass Production​ High-volume, fully automated assembly. Consumer electronics, automotive.
 

 

 

DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com

 

 

 

♦ Technical Parameters

 

 PCB Assembly Capability

 

Item

 

                  Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

                      T>2mm

 

 

 

 

♦ Application Fields

 

5G Communication Module Oem Circuit Boards PCB Assembly Processing 0 5G Communication Module Oem Circuit Boards PCB Assembly Processing 1 5G Communication Module Oem Circuit Boards PCB Assembly Processing 2 5G Communication Module Oem Circuit Boards PCB Assembly Processing 3
PCBA Prototype Industrial Control PCBA Telecom PCBA Medical PCBA
5G Communication Module Oem Circuit Boards PCB Assembly Processing 4 5G Communication Module Oem Circuit Boards PCB Assembly Processing 5 5G Communication Module Oem Circuit Boards PCB Assembly Processing 6 5G Communication Module Oem Circuit Boards PCB Assembly Processing 7
Automotive PCBA Consumer Electronic PCBA LED PCBA  Security PCBA

 

 
 
 
♦ Advantages of DQS Team
 
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production