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2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask

MOQ:	1
Price:	Contact Us
Payment Terms:	T/T
Supply Ability:	200,000+ m² PCB per Month

Detail Information

Product Description

Detail Information

Layer:

10 Layers

Material:

Fr4

Thickness:

2.0 Mm

Construction:

2+N+2

Min. Line Width/Space:

0.1/0.1mm

Surface Treatment:

Immersion Gold

Type:

Customizable

Application:

Medical Device

Standard:

UL&IPC Standard &ISO

Supply Ability:

200,000+ m² PCB per Month

Highlight:

2.0mm hdi pcb board

hdi pcb board assembly

Inverter hdi multilayer pcb

Product Description

HDI PCB Board for Inverter with Green Solder Mask

♦ What is Solder Mask?

Solder Mask (also called solder resist or solder stop mask) is a thin, protective layer of polymer applied to the copper traces of a printed circuit board (PCB) to prevent oxidation, short circuits, and unintended solder connections during assembly.

Key Characteristics:

1. Prevents Solder Bridging
  - Covers exposed copper traces to avoid accidental solder connections between pads or traces.
2. Protects Copper from Oxidation
  - Shields copper from moisture, dust, and environmental damage.
3. Improves Electrical Insulation
  - Acts as a dielectric barrier to prevent electrical shorts.
4. Enhances PCB Durability
  - Resists scratches, chemicals, and mechanical stress.
5. Aesthetic & Identification
  - Typically green (but available in other colors) with silkscreen markings for component placement.

♦ Types of Solder Mask?

Type	Description	Common Uses
Liquid Photoimageable (LPI)	Applied as a liquid, exposed to UV light, and developed (most common).	Standard PCBs, high-precision designs.
Dry Film Solder Mask	Pre-formed film laminated onto the PCB, then UV-exposed and etched.	High-density PCBs (HDI).
Top & Bottom Side Masks	Applied only to specific sides (e.g., single-sided PCBs).	Simple boards with limited layers.
Peelable Solder Mask	Temporary mask that can be removed after soldering.	Selective protection during assembly.

♦ Types of Solder Mask?

Feature	Solder Mask Covered	Exposed Copper (No Mask)	Solder Mask Defined (SMD) Pads	Non-Solder Mask Defined (NSMD) Pads
Protection	Yes	No	Partial (mask covers edges)	No (pad extends beyond mask)
Solderability	Prevents solder spreading	Solder adheres fully	Controlled solder flow	More solder volume
Common Use	General traces	Test points, ground pads	Fine-pitch components (BGAs, QFNs)	High-reliability soldering

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Tags:

Fr4 pcb board fabrication

1OZ pcb design manufacturing

Low Volume circuit board fabrication

24 Layer FR4 High Frequency PCB Board 2.5mm Immersion Gold Surface For Mobile

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