20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm

Telecom PCB Assembly Millimeter Wave Antenna Module High Frequency Signal Processing

♦ What's Telecom PCB Assembly?

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

• ​​5G/4G base stations​​
• ​​Fiber-optic networking devices​​
• ​​Satellite communication systems​​
• ​​Routers, switches, and modems​​
• ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

♦ Features of Telecom PCBs:

1. High-Frequency Materials​​

• • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
  • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

• • ​​8+ layers​​ for complex routing.
  • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

• • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
  • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

• • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

• • • ​​IPC-A-600, IPC-6012​​ (for reliability).
    • ​​RoHS, REACH​​ (for environmental safety).
    • ​​FCC, CE, ITU-T​​ (for telecom regulations).

♦ Precautions for Use and Maintenance

• • Environmental adaptation: Weather-resistant PCB for outdoor use (such as FR-4+UV coating, IP65 protection); Enhanced heat dissipation in high temperature environment.

  • Static protection: Wear an anti-static wristband and use an anti-static tray during operation (chip sensitivity <50V).

  • Regular inspection: TDR to measure signals, X-Ray to check BGA solder joints; clean the surface to prevent dust accumulation.

  • Avoid overload: prohibit over-current/voltage/rate to prevent module burning or packet loss.

  • Upgrade and maintenance: Official firmware upgrade, backup configuration parameters.

♦ Technical Parameters

 

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