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Telecom PCB Assembly
Created with Pixso.

1.0mm Telecom SMT Circuit Board PCB Assembly For IoT Devices

1.0mm Telecom SMT Circuit Board PCB Assembly For IoT Devices

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Layer:
16L
Base Material:
FR-4
Board Thickness:
1.0mm
Min. Component Size:
0201
Min. Hole Size:
0.1mm
Pin Space:
0.2mm
PCB Assembly Method:
SMT/DIP
Application:
IoT Devices
Highlight:

Telecom smt circuit board

,

1.0mm smt circuit board

,

IoT smt circuit board assembly

Product Description

 

Low Power Consumption High Integration Telecom PCB Assembly for IoT Devices

 

♦ What's Telecom PCB Assembly?

 

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

  • ​​5G/4G base stations​​
  • ​​Fiber-optic networking devices​​
  • ​​Satellite communication systems​​
  • ​​Routers, switches, and modems​​
  • ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

 

 

♦ Features of Telecom PCBs:

 

1. High-Frequency Materials​​

    • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
    • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

    • ​​8+ layers​​ for complex routing.
    • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

    • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
    • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

    • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

      • ​​IPC-A-600, IPC-6012​​ (for reliability).
      • ​​RoHS, REACH​​ (for environmental safety).
      • ​​FCC, CE, ITU-T​​ (for telecom regulations).

 

♦ Technical Parameters

 

 PCB Assembly Capability

 

Item

 

                  Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

                      T>2mm

 
 
 
 
♦ One-Stop PCBA Solution

 

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♦ Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production