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BGA Circuit Board Assembly for Industrial Control
♦ What Is BGA Assembly?
BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:
♦ Key Features of Contract Manufacturing:
♦ Common Challenges in BGA Assembly:
♦ Technical Parameters
PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
2. Quality Guaranteed:
3. Premium Service:
Would you like details on BGA rework or inspection techniques?
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